Micromachining method for patterning a material
US10350705B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jul 1, 2015 |
| Grant date | Jul 16, 2019 |
| Priority date | — |
| Expiry date | Dec 14, 2035 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG06K1/126
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
The present invention relates to a micromachining method for patterning a material. The pattern is made up of a plurality of points. Said method includes the following steps: —emitting a spatially and temporally coherent pulsed light beam; —dynamically shaping said spatially and temporally coherent pulsed light beam in a modulation plane of a dynamic optical modulation device by applying at least one phase modulation so as to shape said light beam in accordance with the plurality of points forming the pattern; and —focusing the thus-shaped light beam, by means of a focusing device, on one surface of said material placed within a working plane in a Fourier configuration relative to the modulation plane. In said method, patterning the material is carried out with a pulse train containing a finite number of pulses of said light beam that is strictly less than the number of points forming the pattern, and emission of the light beam is controlled so that each pulse has a predetermined pulse duration between 10 ps and 100 ns. The invention also relates to a micromachining system for implementing said method and to a method for using said system.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.