Systems for bonding surfaces using a releasable adhesive
US10350852B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Nov 11, 2015 |
| Grant date | Jul 16, 2019 |
| Priority date | — |
| Expiry date | Aug 12, 2037 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC09J2483/006
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
A releasable adhesive system for joining a first surface to a second surface. The system includes a primary material having a first portion including at least one first-portion molecule configured to be positioned parallel with at least one first-surface molecule of the first surface, and a second portion, opposite the first portion, including at least one second-portion molecule configured to be positioned parallel with at least second surfaced one molecule of the second surface. The first surface molecule, positioned parallel with the first-surface molecule, is configured to maintain bonds between the first portion and the first surface up to one or more pre-determined three scenarios, such as pre-determined shear, pull, and peel forces being exerted on the first surface. The second portion can function similarly with respect to the second surface.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.