Integrated package containing MEMS acoustic sensor and pressure sensor
US10351419B2 · kind B2 · utility
2Cited by
4References
19Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | May 20, 2016 |
| Grant date | Jul 16, 2019 |
| Priority date | — |
| Expiry date | May 20, 2036 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/16152
- WIPO fieldMicro-structural and nano-technology
- WIPO sectorChemistry
Abstract
Integrated microelectromechanical systems (MEMS) acoustic sensor devices are disclosed. Integrated MEMS acoustic sensor devices can comprise a MEMS acoustic sensor element and a pressure sensor within the back cavity associated with the MEMS acoustic sensor element. Integrated MEMS acoustic sensor devices can comprise a port adapted to receive acoustic waves or pressure. Methods of fabrication are also disclosed.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.