Methods for reducing surface defects
US10351472B2 · kind B2 · utility
1Cited by
1References
20Claims
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Key dates
| Filing date | Aug 9, 2017 |
| Grant date | Jul 16, 2019 |
| Priority date | — |
| Expiry date | Oct 10, 2037 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC03C2204/00
- WIPO fieldMaterials, metallurgy
- WIPO sectorChemistry
Abstract
Methods for reducing a defective area in a strengthened substrate to produce a non-defective substrate are provided. The methods include contacting a strengthened defective substrate with a heated salt bath containing at least one monovalent salt, and removing the strengthened substrate from the bath. The strengthened substrate, before being contacted with the salt bath, is a defective substrate having at least one defective area and one or more non-defective area. Upon removal from the salt bath, at least one defective area has been reduced or substantially removed to produce a non-defective substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.