Thermosetting resin composition, method of producing thermal conductive sheet, and power module
US10351728B2 · kind B2 · utility
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11Claims
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Key dates
| Filing date | Jan 10, 2014 |
| Grant date | Jul 16, 2019 |
| Priority date | — |
| Expiry date | Jul 8, 2034 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2224/32245
- WIPO fieldOther special machines
- WIPO sectorMechanical engineering
Abstract
A thermosetting resin composition containing a thermosetting resin and an inorganic filler, in which the inorganic filler contains secondary sintered particles (A) formed of primary particles of boron nitride, which have an aspect ratio of 10 to 20, and secondary sintered particles (B) formed of the primary particles of boron nitride, which have an aspect ratio of 2 to 9. The thermosetting resin composition can produce a thermal conductive sheet that has excellent filling property of the inorganic filler, and excellent thermal conductivity, adhesiveness and electrical insulating properties.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.