Silicone pressure sensitive adhesives
US10351742B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jan 19, 2016 |
| Grant date | Jul 16, 2019 |
| Priority date | — |
| Expiry date | Jan 27, 2036 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC08G77/70
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
The invention provides a process for the production of a pressure sensitive adhesive, comprising dissolving a particulate solid MQ silicone resin having a bulk density in the range 0.4-0.9 g/cm3 in a volatile solvent, and dissolving a polydiorganosiloxane having a viscosity of 0.1 to 40,000 Pa·s at 25° C. in the volatile solvent before, simultaneously with or after dissolving the solid MQ silicone resin. The process of the present invention allows the production of a pressure sensitive adhesive in a solvent different from the solvent in which the MQ silicone resin was prepared.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.