Stand assembly for an electronic device providing multiple degrees of freedom and built-in cables
US10352496B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | May 26, 2017 |
| Grant date | Jul 16, 2019 |
| Priority date | — |
| Expiry date | Aug 5, 2037 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH04N23/55
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A stand assembly for an electronic device includes a neck portion with a first end that holds and extends from the electronic device, a spine portion that is coupled via a joint structure to a second end of the neck portion, the joint structure being configured to provide a first rotational degree of freedom of the neck portion with respect to the spine portion, and one or more interconnect wires. The one or more interconnect wires include a first wire portion, a second wire portion and a third wire portion, the first wire portion being routed through an interior of the neck portion, the second wire portion being routed along a surface of the spine portion, and the third wire portion being routed though the joint structure from the surface of the spine portion to the interior of the neck portion.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.