Method for manufacturing mold or optical element
US10353119B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Nov 9, 2017 |
| Grant date | Jul 16, 2019 |
| Priority date | — |
| Expiry date | Nov 9, 2037 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/24355
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A method for manufacturing a mold or an optical element provided with a fine surface roughness for anti-reflection or for diffusing, may include placing a substrate or a film made of a semiconductor or a metal into a reacting etching apparatus, introducing a mixed gas of sulfur hexafluoride and oxygen into the etching apparatus with the substrate or the film, tuning the mixed gas into plasma such that oxides are made to be scattered on a surface of the substrate or the film, and etching the surface of the substrate of the film by the sulfur hexafluoride while the oxides function as an etching mask to form the fine surface roughness on the surface of the substrate or the film. Further, etching conditions may be determined such that the pitch of the fine surface roughness is made from 3 to 18 micrometers.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.