Cosmetic co-removal of material for electronic device surfaces
US10353436B2 · kind B2 · utility
3Cited by
50References
20Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Apr 21, 2016 |
| Grant date | Jul 16, 2019 |
| Priority date | — |
| Expiry date | Aug 9, 2036 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49169
- WIPO fieldTelecommunications
- WIPO sectorElectrical engineering
Abstract
This is directed to providing a cosmetic finish on a component constructed by connecting several elements. A single manufacturing process, such as machining or grinding, can be applied to the connected elements to remove material from some or all of the elements and to form a smooth and continuous surface across interfaces between the individual elements of the component. In some cases, settings of the material removal process can be adjusted based on the material of the component elements. For example, the settings can be adjusted based on the manufacturing or mechanical properties of each element material.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.