Composition for forming conductive pattern and resin structure having conductive pattern
US10354774B2 · kind B2 · utility
0Cited by
6References
10Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Aug 3, 2015 |
| Grant date | Jul 16, 2019 |
| Priority date | — |
| Expiry date | May 11, 2036 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/24917
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
The present invention relates to a composition for forming a conductive pattern that enables forming conductive micropatterns on various polymer resin products or resin layers by a simplified process without deformation of the polymer resin products or resin layers, and enables effectively satisfying requirements of the art, and a resin structure having a conductive pattern.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.