Reduction of dielectric losses through use of organoclay in semiconductor or insulator compositions
US10354775B2 · kind B2 · utility
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3References
13Claims
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Assignee
Inventors
Key dates
| Filing date | Mar 23, 2018 |
| Grant date | Jul 16, 2019 |
| Priority date | — |
| Expiry date | Mar 23, 2038 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01B3/441
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
Organoclays are added to semiconductive compositions to provide a reduction in the dielectric losses of layered composites in which the semiconductive layer contains species which could migrate into the insulation and result in undesirably high dielectric losses. The invention semiconductive compositions provide improved performance in power cable applications.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.