Nanowire bundle and method of manufacturing nanostructure
US10354869B2 · kind B2 · utility
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20Claims
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Key dates
| Filing date | Oct 11, 2017 |
| Grant date | Jul 16, 2019 |
| Priority date | — |
| Expiry date | Oct 11, 2037 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB82Y30/00
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A method of manufacturing a nanostructure includes: heating a mixed solution to a first temperature, the mixed solution including a solvent, a compound including indium, and an octadecylphosphonic acid; heating the mixed solution to a second temperature; injecting, after heating the mixed solution to the second temperature, a phosphine precursor into the mixed solution; and heating the mixed solution including the injected phosphine precursor to a third temperature.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.