Electronic component having a heat dissipation member formed on a sealing member
US10354936B2 · kind B2 · utility
2Cited by
4References
19Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jul 11, 2017 |
| Grant date | Jul 16, 2019 |
| Priority date | — |
| Expiry date | Jul 11, 2037 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2224/73265
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An electronic component includes a substrate having a principal surface, a chip arranged at the principal surface of the substrate, a sealing resin sealing the chip on the principal surface of the substrate, and a heat dissipation member formed on the sealing resin.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.