Systems and methods for microelectronics fabrication and packaging using a magnetic polymer
US10354950B2 · kind B2 · utility
3Cited by
21References
19Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Feb 25, 2016 |
| Grant date | Jul 16, 2019 |
| Priority date | — |
| Expiry date | Feb 25, 2036 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/3025
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A magnetic polymer for use in microelectronic fabrication includes a polymer matrix and a plurality of ferromagnetic particles disposed in the polymer matrix. The magnetic polymer can be part of an insulation layer in an inductor formed in one or more backend wiring layers of an integrated device. The magnetic polymer can also be in the form of a magnetic epoxy layer for mounting contacts of the integrated device to a package substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.