Microcircuit card assembly including dual-sided cooling paths
US10354979B1 · kind B1 · utility
3Cited by
4References
17Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Feb 12, 2018 |
| Grant date | Jul 16, 2019 |
| Priority date | — |
| Expiry date | Feb 12, 2038 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2225/1094
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A three-dimensional (3D) circuit card assembly includes a substrate package and a passive heat transfer unit. The substrate package includes a plurality of individual substrates stacked atop one another. The passive heat transfer unit includes at least one intermediate heat dissipation plate configured to receive heat from the substrate package, and a thermally conductive dissipation cover configured to dissipate the heat received from the at least one intermediate heat dissipation plate away from the 3D circuit card assembly.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.