Encapsulated LED lens with bottom reflectors
US10355182B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Mar 6, 2014 |
| Grant date | Jul 16, 2019 |
| Priority date | — |
| Expiry date | Mar 6, 2034 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2224/13
Abstract
A lens is affixed over an LED die mounted on a substrate to encapsulate the LED die. The lens may have a top surface shaped as a dome or other shape to achieve the desired light pattern. The lens has a cavity for the LED die. A reflector pattern is molded into the bottom surface of the lens, such as one or more facet rings with an angled surface surrounding the LED die. The angled surface of the facet ring reflects the downward or shallow light emission from the LED die upward. A plurality of facet rings of different radii and heights may be formed in the bottom of the lens for shaping the light emission. Any suitable shape of facet may be used. The facet rings may be formed to cause the LED module to emit a narrow beam or other light emission patterns.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.