Pin through solder interconnect and methods
US10355380B1 · kind B1 · utility
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1References
19Claims
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Key dates
| Filing date | Mar 28, 2018 |
| Grant date | Jul 16, 2019 |
| Priority date | — |
| Expiry date | May 13, 2038 |
Classification
- Technology area (CPC —)General
Abstract
An electronic device that includes a first electronic component with a pin element and a second electronic component with a solder element. A joint is formed that provides an electrical and mechanical connection between the first electronic component and second electronic component when the pin element is heated, inserted into the solder element, and cooled.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.