Manufacturing method for flexible printed circuit board
US10356910B2 · kind B2 · utility
1Cited by
3References
10Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Jun 23, 2016 |
| Grant date | Jul 16, 2019 |
| Priority date | — |
| Expiry date | Nov 27, 2036 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/128
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
The invention provides a manufacturing method for flexible printed circuit board, by liquefying the flexible insulating material and the metal material, coating the liquefied materials and solidifying the coated layers to form respectively the flexible insulating layer and the anti-EMI layer of the anti-EMI structure. As such, an adhesive layer is eliminated to achieve reducing the thickness of the flexible insulating layer and the anti-EMI layer and the material consumption, resulting in reduced production cost, reduced thickness of the flexible printed circuit board with anti-EMI structure, and improved quality.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.