Electronic assembly with enhanced high power density
US10356926B1 · kind B1 · utility
0Cited by
2References
17Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Mar 15, 2018 |
| Grant date | Jul 16, 2019 |
| Priority date | — |
| Expiry date | Mar 15, 2038 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/167
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
An electronic assembly comprises a gate drive module comprising multiple circuit board layers sandwiched together, where each layer has a central opening that is aligned with the other layers. A switching circuit chipset is positioned in the central opening. The switching circuit chipset has lead frames for providing electrical connections to the switching circuit chipset. The lead frames are alignable with pockets in two or more of the layers to facilitate alignment of the contact portions of the lead frames with corresponding conductive pads on the circuit board.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.