Electronic equipment data center or co-location facility designs and methods of making and using the same
US10356939B2 · kind B2 · utility
1Cited by
209References
20Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Dec 5, 2017 |
| Grant date | Jul 16, 2019 |
| Priority date | — |
| Expiry date | Dec 5, 2037 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K7/20745
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
The present invention relates to electronic equipment data center or co-location facility designs and methods of making and using the same in an environmentally aware manner, and generally provides apparatus and methods for using novel support bracket structures, and thermal panels associated with the same, that allow for distinct partitioning of air flowing in hot aisles and cold aisles, as well as for holding wiring above cabinets that are used to store electronic equipment in the facility.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.