Hot melt adhesive supply and methods associated therewith
US10357796B2 · kind B2 · utility
1Cited by
9References
26Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Feb 12, 2016 |
| Grant date | Jul 23, 2019 |
| Priority date | — |
| Expiry date | Aug 29, 2037 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB05B15/25
- WIPO fieldThermal processes and apparatus
- WIPO sectorMechanical engineering
Abstract
A melter for heating and melting particulate hot melt adhesive into a liquefied form is disclosed. The melter includes a heated receiving device having an interior with an inlet configured to receive the particulate hot melt adhesive and an outlet. A flexible hopper holds a supply of the particulate hot melt adhesive and a particulate hot melt adhesive feed device allows the particulate hot melt adhesive to be directed from the flexible hopper to the inlet of the heated receiving device.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.