Luminescent substrate containing abrasive particles, and method for the production thereof
US10357869B2 · kind B2 · utility
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9Claims
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Key dates
| Filing date | Sep 29, 2016 |
| Grant date | Jul 23, 2019 |
| Priority date | — |
| Expiry date | Sep 29, 2036 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB24B49/12
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
An abrasive sawing or polishing substrate includes a substrate, a binder C1 covering at least a portion of the substrate, and abrasive particles having an at least partial coating, C2. The abrasive sawing or polishing substrate also includes a coating C3 coating binder C1 and the abrasive particles coated with C2 and at least one light-emitting compound. The abrasive particles coated with C2 are in contact with binder C1 and with coating C3.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.