Systems and methods for reinforced adhesive bonding
US10357941B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jul 28, 2014 |
| Grant date | Jul 23, 2019 |
| Priority date | — |
| Expiry date | May 5, 2035 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/041
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
The present disclosure relates to a bonding system (100) comprising an adhesive (200), in contact with a first contact surface (115) and a second contact surface (125), and a solder mesh (310) positioned in the adhesive (200) in contact with the first contact surface (115). Also, the present disclosure relates to a bonding method to produce a solder-reinforced adhesive bond joining a first substrate (110) and a second substrate (120), comprising applying, on a first contact surface (115) of the first substrate (110), an adhesive (200), positioning, at least partially into the adhesive (200), a solder mesh (310), such that the solder mesh (310) contacts the first contact surface (115), connecting, to a portion of the adhesive (200) opposite the first contact surface (115), a second contact surface (125) of the second substrate (120), and applying heat to the first contact surface (115) such that at least one portion of the solder mesh (310) reaches a solder-bonding temperature.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.