Composite body and method for manufacturing same
US10358704B2 · kind B2 · utility
3Cited by
0References
6Claims
0Family size
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Key dates
| Filing date | Jul 3, 2015 |
| Grant date | Jul 23, 2019 |
| Priority date | — |
| Expiry date | Dec 21, 2035 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/12944
- WIPO fieldMaterials, metallurgy
- WIPO sectorChemistry
Abstract
A composite is obtained by press-molding a mixed powder comprising 20-50 vol % of a metal powder and 50-80 vol % of a diamond powder for which a first peak in a volumetric distribution of particle size lies at 5-25 μm, and a second peak lies at 55-195 μm, and a ratio between the area of a volumetric distribution of particle sizes of 1-35 μm and the area of a volumetric distribution of particle sizes of 45-205 μm is from 1:9 to 4:6, thereby obtaining a composite having a high thermal conductivity and a coefficient of thermal expansion close to that of semiconductor devices, which is easy to mold into a prescribed shape.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.