Substrate for light emitting device and manufacturing method of substrate for light emitting device
US10359181B2 · kind B2 · utility
2Cited by
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30Claims
0Family size
Assignee
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Key dates
| Filing date | Oct 20, 2015 |
| Grant date | Jul 23, 2019 |
| Priority date | — |
| Expiry date | Feb 12, 2036 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
An electrode pattern (13) formed on a ceramics layer (2) in a substrate for a light emitting device (circuit board (320)) of the present invention includes a first metal layer (5), a second metal layer (7), and an electrode terminal unit (10), and the thickness of a part at which the electrode terminal unit (10) is not formed in the electrode pattern (13) is at least equal to or greater than 35 μm. Accordingly, it is possible to suppress heat resistance to be low.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.