Manifold design to eliminate fractures on multistage heat exchanger coils
US10359218B2 · kind B2 · utility
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16Claims
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Assignee
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Key dates
| Filing date | Oct 28, 2016 |
| Grant date | Jul 23, 2019 |
| Priority date | — |
| Expiry date | Oct 28, 2036 |
Classification
- Technology area (CPC F)Mechanical Engineering; Lighting; Heating
- CPC primaryF28F2270/02
- WIPO fieldThermal processes and apparatus
- WIPO sectorMechanical engineering
Abstract
A system and method for a multistage condenser is described that reduces problems associated with temperature and pressure differential strains on tubes above and below a dead tube. Instead of connecting the dead tube to the I/O manifold, a physical separation is created. The physical separation can be created by shortening the dead tube, coring a portion of the I/O manifold where the dead tube is received, independent I/O manifolds, or other means.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.