Flexible sensor circuit arrangement
US10359384B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | Apr 10, 2015 |
| Grant date | Jul 23, 2019 |
| Priority date | — |
| Expiry date | Mar 14, 2036 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01R27/2605
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
The field is sensors used in the ground and in particular the provision of a sensor array element for a sensor array useable in housing that has a tapered internal and external shape. The lack of air spaces and gaps, in particular, between the outer surface of the hollow elongate sensor housing and the surrounding ground is substantially avoided when using a tapered housing. A sensor array element is disclosed including a carrier sheet of flexible material formable into a shape which substantially conforms with the shape of the inner wall of said elongate housing. The carrier sheet has electrically conductive regions wherein at least one pair of electrically conductive regions are shaped and located near enough each other to form a capacitive element. The carrier sheet has at least two pairs of electrically conductive regions forming a pair of capacitive elements, and adjacent pairs of capacitive elements have a different diameter. When the carrier sheet is shaped to substantially conform to the inner wall of the elongate housing and the capacitive element connected to a tuned circuit, the capacitive element and tuned circuit are usable to sense at least the moisture content of the…
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.