Input device haptics and pressure sensing
US10359848B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Sep 19, 2016 |
| Grant date | Jul 23, 2019 |
| Priority date | — |
| Expiry date | Sep 19, 2036 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG06F3/03547
- WIPO fieldComputer technology
- WIPO sectorElectrical engineering
Abstract
Input device haptics and pressure sensing techniques are described. An input device includes an outer surface, a pressure sensor and haptic feedback mechanism, and a pressure sensing and haptic feedback module. The outer surface is configured to receive an application of pressure by an object. The pressure sensor and haptic feedback mechanism has one or more piezos configured to detect and quantify an amount of the application of the pressure to the outer surface by the object, the one or more piezos configured to output a signal indicating the quantified amount of the pressure. The pressure sensing and haptic feedback module is configured to receive the signal from the one or more piezos indicating the quantified amount of the pressure and control the haptic feedback of the pressure sensor and haptic feedback mechanism.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.