Tool health monitoring and matching

US10360671B2 · kind B2 · utility

Assignee

• KLA-TENCOR CORPORATION · US

Inventors

• Ravichander Rao · Bengaluru, IN
• Gary Taan · San Jose, US
• Andreas Russ · Wurmberg, DE
• Bjorn Brauer · Beaverton, US
• Roger B. Davis · Clinton, US
• Bryant Mantiply · Mountain View, US
• Swati Ramanathan · Oakland, US
• Karen Biagini · Watsonville, US

Key dates

• Filing date: Jul 11, 2017
• Grant date: Jul 23, 2019
• Expiry date: Sep 7, 2037

Classification

• Technology area (CPC H): Electricity
• CPC primary: H01L22/12
• WIPO field: Measurement
• WIPO sector: Instruments

Abstract

Systems and methods for tool health monitoring and matching through integrated real-time data collection, event prioritization, and automated determination of matched states through image analysis are disclosed. Data from the semiconductor production tools can be received in real-time. A control limit impact (CLI) of the parametric data and the defect attributes data can be determined and causation factors can be prioritized. Image analysis techniques can compare images and can be used to judge tool matching, such as by identifying one of the states at which the two or more of the semiconductor manufacturing tools match.