Semiconductor wire bonding machine cleaning device and method
US10361169B2 · kind B2 · utility
8Cited by
52References
23Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Oct 2, 2017 |
| Grant date | Jul 23, 2019 |
| Priority date | — |
| Expiry date | Oct 2, 2037 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/13091
- WIPO fieldChemical engineering
- WIPO sectorChemistry
Abstract
A methodology and medium for regular and predictable cleaning the support hardware such as capillary tube in semiconductor assembly equipment components, while it is still in manual, semi-automated, and automated assembly are disclosed. The cleaning material may include a cleaning pad layer and one or more intermediate layers that have predetermined characteristics.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.