Processing substrates using a temporary carrier
US10361228B2 · kind B2 · utility
0Cited by
1References
13Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Oct 13, 2015 |
| Grant date | Jul 23, 2019 |
| Priority date | — |
| Expiry date | May 26, 2037 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02P70/50
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A technique comprising: securing a device substrate (8) to a carrier (1) using one or more adhesive elements (6); forming electronic elements (10) on the device substrate with the device substrate thus secured to the carrier; and thereafter reducing the adhesion strength of at least one of the one or more adhesive elements to facilitate the release of the substrate from the carrier.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.