Flexible circuit board having three-layer dielectric body and four-layer ground layer structure
US10362675B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Mar 16, 2018 |
| Grant date | Jul 23, 2019 |
| Priority date | — |
| Expiry date | Mar 16, 2038 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/09327
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
Disclosed is a flexible circuit board having a three-layer dielectric body and four-layer ground layer structure. A flexible circuit board having a three-layer dielectric body and four-layer ground layer structure, according to the present invention, comprises: a first dielectric body; a second dielectric body facing the flat surface of the first dielectric body; a third dielectric body facing the bottom side of the first dielectric body; a signal line formed on the flat surface of the first dielectric body; a pair of first ground layers laminated on the flat surface of the first dielectric body and having the signal line therebetween; second ground layers laminated on the bottom side of the first dielectric body so as to correspond to the first ground layers; a third ground layer laminated on the flat surface of the second dielectric body; and a fourth ground layer laminated on the bottom side of the third dielectric body.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.