Patent · US Active

Lead-free solder and electronic component built-in module

US10362686B2 · kind B2 · utility

2Cited by

8References

2Claims

0Family size

Assignee

TDK CORPORATION · JP

Inventors

Tsutomu Yasui · Tokyo, JP
Hisayuki Abe · Tokyo, JP
Kenichi Kawabata · Hiratsuka, JP
Tomoko Kitamura · Ome, JP

Key dates

Filing date	Sep 23, 2015
Grant date	Jul 23, 2019
Priority date	—
Expiry date	Nov 4, 2036

Classification

Technology area (CPC H)Electricity
CPC primaryH05K3/3485
WIPO fieldMachine tools
WIPO sectorMechanical engineering

Abstract

First solder is lead-free solder that contains no lead (Pb). The first solder includes a first metal that contains at least Sn; and a second metal that contains at least a Ni—Fe alloy.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.