Support removal tool for additive manufacture
US10363680B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Sep 13, 2016 |
| Grant date | Jul 30, 2019 |
| Priority date | — |
| Expiry date | Dec 3, 2036 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02P10/25
- WIPO fieldMaterials, metallurgy
- WIPO sectorChemistry
Abstract
Aspects of the disclosure include a machine and system for support removal and a laser-sintered component compatible with same. A laser-sintered component may have a component surface and at least one laser-sintered support extending from the component surface. A press may move a cutting surface along a cutting path adjacent to the component surface. The cutting surface has a shape complementary to the component surface and at least one cutting edge positioned to separate at least one laser-sintered support from the component surface as the cutting surface moves along the cutting path.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.