Card substrate warpage reduction

US10363725B2 · kind B2 · utility

Assignee

• ASSA ABLOY AB · SE

Inventors

• Ted M. Hoffman · Eden Prairie, US
• Brent D. Lien · Minneapolis, US

Key dates

• Filing date: Jul 22, 2014
• Grant date: Jul 30, 2019
• Expiry date: Jul 22, 2034

Classification

• Technology area (CPC Y): Emerging Cross-Sectional Technologies
• CPC primary: Y10T156/171
• WIPO field: Surface technology, coating
• WIPO sector: Chemistry

Abstract

Embodiments of the invention are directed to a transfer lamination process and apparatus that reduces substrate warpage. In some embodiments, the transfer lamination process is performed using a transfer lamination device, which includes a transfer unit, a substrate rotator, and a transfer ribbon having a carrier layer and a transfer layer attached to the carrier layer. In some embodiments of the transfer lamination process, a transfer section of the transfer layer is transferred from the carrier layer to a first surface of a substrate using the transfer unit. In some embodiments of this transferring step, the transfer section is heated and pressed against the first surface of the substrate using the transfer unit, and the carrier layer is detached from the transfer section. The substrate is then inverted using the substrate rotator. At least a portion of a second surface of the substrate that is opposite the first surface is then heated using the transfer unit without transferring the transfer layer to the portion of the second surface.