Integral hot melt adhesive packaging films and use thereof
US10364079B2 · kind B2 · utility
0Cited by
37References
3Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jan 22, 2016 |
| Grant date | Jul 30, 2019 |
| Priority date | — |
| Expiry date | Jan 25, 2038 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/1397
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
Propylene polymer based packaging films for encapsulating hot melt adhesives are disclosed. The packaging films are readily miscible with the various hot melt adhesive chemistries during the melting stage without deleteriously affecting the adhesive properties, making the packaging film particularly well suited for packaging hot melt adhesives in a pillow, cylinder, pouch, block, cartridge and like forms.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.