Thermoplastic resin composition and molded article comprising the same
US10364348B2 · kind B2 · utility
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12Claims
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Key dates
| Filing date | Aug 26, 2016 |
| Grant date | Jul 30, 2019 |
| Priority date | — |
| Expiry date | Jul 1, 2037 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC08L67/02
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
A thermoplastic resin composition and a molded article including the same are disclosed herein. The thermoplastic resin composition includes a base resin including a polycarbonate (PC) resin and a polyester resin, inorganic fillers, and an aromatic (meth)acrylate polymer, wherein the aromatic (meth)acrylate polymer is a copolymer of a monomer mixture including a vinyl cyanide monomer, an aromatic vinyl monomer, and an aromatic (meth)acrylate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.