Patent · US Active

Assemblies containing polyetherketoneketone tie layers

US10364349B1 · kind B1 · utility

4Cited by
57References
8Claims
0Family size

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Key dates

Filing dateMay 19, 2017
Grant dateJul 30, 2019
Priority date—
Expiry dateMay 19, 2037

Classification

  • Technology area (CPC Y)Emerging Cross-Sectional Technologies
  • CPC primaryY10T428/31855
  • WIPO fieldSurface technology, coating
  • WIPO sectorChemistry

Abstract

Tie layers comprised of amorphous polyetherketoneketone are used to join substrates to form laminates and other assemblies.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.