Dissolution guided wetting of structured surfaces
US10364411B2 · kind B2 · utility
1Cited by
21References
14Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jun 1, 2018 |
| Grant date | Jul 30, 2019 |
| Priority date | — |
| Expiry date | Jun 1, 2038 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01N2035/00158
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
A microfabricated device having at least one gas-entrapping feature formed therein in a configuration that entraps air bubbles upon wetting the feature with a solvent or solution is described. The device includes a sacrificial residue in contact with the gas-entrapping feature, the dissolution of which guides the wetting of the gas-entrapping feature.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.