Housing for a high-frequency chip
US10365145B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Mar 7, 2018 |
| Grant date | Jul 30, 2019 |
| Priority date | — |
| Expiry date | Mar 7, 2038 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2223/6677
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
A housing for a high-frequency chip in a radar device for level measurement is provided, including a high-frequency chip having a high-frequency terminal and a supply terminal; horizontal metal layers; vertical metal connecting lines; and an external supply terminal configured to connect the chip to a circuit board of the device, the chip being attached to one of the horizontal metal layers in an electrically conductive manner, and being embedded in a polymer compound, which is located between the horizontal metal layers, the supply terminal being connected to the external supply terminal via at least one of the horizontal metal layers and via at least one of the vertical metal connecting lines, and the high-frequency terminal being connected to an antenna configured to decouple and receive radar waves, via at least one of the horizontal metal layers and/or via at least one of the vertical metal connections.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.