Method for manufacturing high frequency signal transmission structure and high frequency signal transmission structure obtained thereby
US10365430B2 · kind B2 · utility
Assignees
Inventors
Key dates
| Filing date | Jul 19, 2017 |
| Grant date | Jul 30, 2019 |
| Priority date | — |
| Expiry date | Nov 17, 2037 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10F39/8057
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
A method for manufacturing high frequency signal transmission structure comprises: providing two dielectric layers, each of the two dielectric layers defining a top surface and a bottom surface and comprising a channel with a bottom open end opened at the top surface and a top open end opened at the bottom surface, an inner diameter of the each of the two channels gradually reducing further from the top open end to the bottom open end; providing a circuit layer with a transmission portion; providing two copper plates; combining the circuit layer, the two dielectric layers and the two copper plates to form a combination; providing a shielding layer around the two air chambers; and providing at least one solder mask covering the shielding layer. The present disclosure also provides a high frequency signal transmission structure obtained by the method.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.