Copackaging of ASIC and silicon photonics

US10365436B2 · kind B2 · utility

Assignee

• Rockley Photonics Limited · GB

Inventors

• Gerald Cois Byrd · Adelanto, US
• David Arlo Nelson · Fort Collins, US
• Javid Messian · West Hollywood, US
• Thomas Pierre Schrans · Temple City, US

Key dates

• Filing date: Jan 4, 2018
• Grant date: Jul 30, 2019
• Expiry date: Jan 4, 2038

Classification

• Technology area (CPC H): Electricity
• CPC primary: H01S5/021
• WIPO field: Optics
• WIPO sector: Instruments

Abstract

A system and method for packing optical and electronic components. A module includes an electronic integrated circuit and a plurality of photonic integrated circuits, connected to the electronic integrated circuit by wire bonds or by wire bonds and other conductors. A metal cover of the module is in thermal contact with the electronic integrated circuit and facilitates extraction of heat from the electronic integrated circuit. Arrays of optical fibers are connected to the photonic integrated circuits.