Digital micro-mirror device with a heat dissipation structure
US10365547B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Aug 28, 2017 |
| Grant date | Jul 30, 2019 |
| Priority date | — |
| Expiry date | Aug 28, 2037 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG09F19/18
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
A digital micro-mirror unit is arranged on a circuit board. A digital micro-mirror device mask surroundingly covers the digital micro-mirror unit. A thermo-insulation element is arranged between the digital micro-mirror unit and the digital micro-mirror device mask. The digital micro-mirror unit is thermally insulated against the digital micro-mirror device mask through the thermos-insulation element. A thermoelectric cooler (TEC) is thermally connected to the digital micro-mirror unit. A thermo-conductive body is attached on the hot side of the TEC. Therefore the digital micro-mirror unit can meet temperature requirements of safety standards and avoid reducing its service life.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.