Pickup and placing device and operation method of picking and placing by pickup and placing device
US10366910B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | May 24, 2017 |
| Grant date | Jul 30, 2019 |
| Priority date | — |
| Expiry date | May 24, 2037 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10H20/0364
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
The current disclosure provides a pickup and placing device including a control element, a substrate and a pickup structure. The substrate has an upper surface and a lower surface opposite to each other and a plurality of conductive via structures, wherein the conductive via structures are electrically connected to the control element. The pickup structure includes a plurality of pickup heads used for picking up or placing a plurality of light emitting diodes respectively. The pickup structure is disposed on the lower surface of the substrate or disposed in the substrate and extended outside the substrate, and the substrate is disposed between the control element and the pickup structure, wherein the pickup heads are electrically connected to the conductive via structures.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.