Cooling device, method for producing a cooling device and power circuit
US10366937B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Mar 5, 2018 |
| Grant date | Jul 30, 2019 |
| Priority date | — |
| Expiry date | Mar 5, 2038 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K1/0203
- WIPO fieldThermal processes and apparatus
- WIPO sectorMechanical engineering
Abstract
A cooling device includes an aluminum heat sink and at least one nickel sheet segment. The nickel sheet segment is connected to the aluminum heat sink by a solder layer. The cooling device includes a securing surface for securing and for heat absorption. The securing surface being formed by that side of the nickel sheet segment which faces away from aluminum heat sink. The aluminum heat sink is formed from a plurality of aluminum sheets which are stacked one above another and are connected to one another. At least one aluminum sheet includes cutouts which form a cooling channel covered by at least one of the aluminum sheets. Furthermore, a method for producing a cooling device and also a power circuit comprising a heat sink as described here are presented.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.