Patent · US Active

Strengthened LED package and method therefor

US10367125B2 · kind B2 · utility

0Cited by

10References

6Claims

0Family size

Assignee

LUMILEDS LLC · US

Inventors

Chee Weng Soong · Bukit Mertajam, MY
Tomonari Ishikawa · Saitama, JP
Su Ping Tan · Bayan Lepas, MY
Chiou Bee Goh · Eindhoven, NL

Key dates

Filing date	Jul 12, 2013
Grant date	Jul 30, 2019
Priority date	—
Expiry date	Jul 12, 2033

Classification

Technology area (CPC H)Electricity
CPC primaryH10H20/0364
WIPO fieldSemiconductors
WIPO sectorElectrical engineering

Abstract

Crimping of an LED leadframe to a subassembly may stress the leadframe. Flat leadframes cannot accommodate these stresses. Strain relief sections are added to the leadframe to accommodate crimping or other stresses on the leadframe. Strain relief sections are created in the leadframe in the form of openings, notches or bulges. The strain relief sections may be symmetric or asymmetric.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.