Method of fabricating a base plate for piezo actuation
US10367135B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | May 5, 2016 |
| Grant date | Jul 30, 2019 |
| Priority date | — |
| Expiry date | May 27, 2037 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T83/0448
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A method of fabricating a base plate for piezoelectric actuation, comprises providing a plate having a major surface, striking a first removable portion of the plate in a first direction substantially normal to the major surface to shear the first removable portion relative to the plate by a shear distance that is less than the plate thickness. Striking the first removable portion in a second direction substantially opposite the first direction to reduce the shear distance by a reduction in shear that is less than the plate thickness. Leaving it the first removable portion in place rather than removing. Alternately, the removable portion may be created by lancing one or more portions spanning at least one opening through a base plate adjacent a first side of at least one opening and adjacent a second side of the at least one opening.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.