Resonator package and method of manufacturing the same
US10367471B2 · kind B2 · utility
1Cited by
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9Claims
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Key dates
| Filing date | Mar 2, 2016 |
| Grant date | Jul 30, 2019 |
| Priority date | — |
| Expiry date | May 28, 2037 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/42
- WIPO fieldBasic communication processes
- WIPO sectorElectrical engineering
Abstract
A resonator package and a method of manufacturing the same are provided. The method of manufacturing a resonator package involves etching a lower electrode with a hardmask, in which only a portion of a thickness of the lower electrode is etched to shape the lower electrode.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.