Thermal solution for transceiver module
US10368464B2 · kind B2 · utility
6Cited by
3References
11Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Oct 13, 2017 |
| Grant date | Jul 30, 2019 |
| Priority date | — |
| Expiry date | Oct 13, 2037 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K7/20818
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A heat dissipating apparatus for cooling a transceiver is provided. The apparatus includes a cooling jacket configured to receive the transceiver. The transceiver is secured within the cooling jacket via a connecting structure. The apparatus also includes cooling devices secured to an exterior surface of the cooling jacket, the plurality of cooling devices comprising a highly thermal conductivity material. The apparatus also includes a heat dissipation device connected to a distal end of each of the plurality of cooling devices.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.