Laser machining apparatus including guide laser
US10369716B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | Oct 11, 2017 |
| Grant date | Aug 6, 2019 |
| Priority date | — |
| Expiry date | Nov 23, 2037 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB23K26/60
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A laser machining apparatus capable of extending the life time of a guide laser is provided. A laser machining apparatus 1 includes a cutting head 2 that irradiates a machining laser light to a machining target W, a guide laser 5 that irradiates a visible guide light to the machining target W, and a power supply 6 that supplies electric power to the guide laser 5. The laser machining apparatus 1 further includes a controller 7 that performs control so that, before the machining laser light is irradiated from the cutting head 2 to the machining target W and laser cutting starts, electric power is supplied from the power supply 6 to the guide laser 5, and the guide light is irradiated from the guide laser 5 to the machining target W according to an output position of the machining laser light output from the cutting head 2 so that the output position of the machining laser light is ascertained. The controller 7 has a laser output setting unit 4 capable of adjusting an output of the guide light of the guide laser 5 within a range where the visibility of the guide light is secured when the guide light is output from the guide laser 5.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.